Bell Labs - Photonic Subsystems Integration Researcher
- PhD in Mechanical Engineering, Electronic Engineering, Physics or related field with an expert level understanding of opto-electronic integration and packaging.
- Strong record of disruptive research in academia and/or industry.
- Strong communication, interpersonal skills.
- Ability to define and pursue a research program in synergy with larger team.
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Opto-electronic packaging and assembly for single-mode high speed transceiver applications
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2.5D semiconductor integration technologies including chip stacking, flip-chip bonding, etc.
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High-speed optical and electronic test and measurement
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Silicon and CMOS wafer fabrication methods and techniques